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                欢迎来到pcb线路板有限公司网站,专注于生产电路板打样,线路板打样,电路板生产,软硬结合板刚柔结合板,高频电路板,线路板生产,深圳电路板线路板,PCB加急板,电路板厂,线路板厂家

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                行业资讯

                印制电路板的IPC标准目录(一)

                  印制电路板(Printed Circuit Boards)

                  IPC-6010 Series IPC-6010 Qualification and Performance Series

                  IPC-6010印制电路板质量标准和性能规范系列手册

                  IPC-A-600F Acceptability of Printed Boards

                  印制板验收条件

                  IPC-6011 Generic Performance Specification for Printed Boards

                  印制板通用性能规范

                  IEC/PAS 62214 Generic Performance Specification for Printed Boards

                  印制板总体性能规范

                  IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

                  刚性印制板的鉴定与性能规范 (包括修改单1)

                  IEC/PAS 62250 Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

                  刚性印制板的鉴定与性能规范

                  IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections

                  有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范

                  IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards

                  聚合物厚膜印制板的鉴定与性能

                  IPC-QE-605A Printed Board Quality Evaluation Handbook

                  印制板质量评价

                  IPC-PWB-EVAL-CH Printed Wiring Board Defect Evaluation Chart

                  印制线路板瑕疵评价流程图册

                  IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards

                  封入式分立布线互连板通用规范

                  IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards

                  印制板分立线路的设计及成品要求(包括修改单1)

                  IPC-DW-426 Specification for Assembly of Discrete Wiring 分立线路组装规范

                  IPC-HM-860 Specification for Multilayer Hybrid Circuits 多层混合电路规范

                  IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards

                  多层互连板热特性

                  IPC-TR-481 Results of Multilayer Tests Program Round Robin

                  多层印制板联合试验计划结果

                  IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

                  用于电子元件安装与互连的印制板质量评价

                  IPC-TR-578 Leading Edge Manufacturing Technology Report

                  前沿制造技术报告

                  IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

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